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Reijnen Sealing now offers the Dam & Fill method, an advanced technique widely used in electronics, semiconductor manufacturing, and intellectual property protection.
This method ensures precise encapsulation of delicate components, providing optimal protection against external influences.

What is the Dam & Fill method?

The Dam & Fill method involves first creating a physical barrier (the dam) around a component. The enclosed area is then filled (the fill) with a specialized casting resin or encapsulation material, such as Wevo 552 UL94 V0 PU.
This provides robust protection against moisture, dust, thermal stress, and mechanical strain, without affecting the functionality of the PCB or component.

In addition to applications in electronics and semiconductor manufacturing, the Dam & Fill method is also used for intellectual property (IP) protection.
By shielding critical components, it significantly reduces the risk of unauthorized access or reverse engineering.

Why choose Dam & Fill from Reijnen Sealing?

• Protection of sensitive components from environmental influences
• Improved thermal performance and mechanical stability
• Reduced risk of solder fractures and electrical interference
• IP protection through encapsulation of critical technology

With this expansion, Reijnen Sealing offers tailored solutions for companies seeking reliable protection for their components and technology.

Would you like to learn more about the Dam & Fill method and how we can apply it to your products? Get in touch with us!